Innovative Common Technologies to Support State-of-the-Art Products SMAFTI Package Technology Features Wide-Band and Large-Capacity Memory KURITA Yoichiro, SOEJIMA Koji, KAWANO Masaya

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Date: 2013-10-01 21:40:28 Technology System in package Semiconductor device fabrication Ball grid array System on a chip Chip scale package Interposer Flip chip Three-dimensional integrated circuit Electronic engineering Integrated circuits Electronics		Innovative Common Technologies to Support State-of-the-Art Products SMAFTI Package Technology Features Wide-Band and Large-Capacity Memory KURITA Yoichiro, SOEJIMA Koji, KAWANO Masaya Add to Reading List Source URL: www.nec.com Download Document from Source Website File Size: 1,54 MB Share Document on Facebook

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