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Technology / System in package / Semiconductor device fabrication / Ball grid array / System on a chip / Chip scale package / Interposer / Flip chip / Three-dimensional integrated circuit / Electronic engineering / Integrated circuits / Electronics


Innovative Common Technologies to Support State-of-the-Art Products SMAFTI Package Technology Features Wide-Band and Large-Capacity Memory KURITA Yoichiro, SOEJIMA Koji, KAWANO Masaya
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Document Date: 2013-10-01 21:40:28

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File Size: 1,54 MB

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Company

KAWANO Masaya Abstract NEC Electronics Corporation / NEC Electronics Corporation / Ball / LSI / NEC Corporation / /

Facility

BGA terminal / /

IndustryTerm

system-on-chip / temperature cycle processing conditions / daisy chain / wire bonding technology / memory chip / information processing / universal technology / connection technology / temperature cycle processing / eld applications / logic chip / digital information equipment / end information processing systems / thick memory chips / digital information processing systems / communications technology / memory chips / pre-processing / inter-chip communications / /

MusicGroup

Features / Data / /

Person

Package Fig / /

Position

Proļ¬les KURITA Yoichiro Assistant Manager / Advanced Device Development Division / SOEJIMA Koji Assistant Manager / Advanced Device Development Division / high-density conductor / conductor / Team Manager / Advanced Device Development Division / /

Technology

1 chips / memory chip / logic TEG chip / Si chips / system-on-chip / package using TEG chips / connection technology / TEG chips / embedded memory TEG chip / communications technology / Chip-On-Chip / thick memory chips / IC chips / Si chip / image processing / memory chips / universal technology / logic chip / 2 Chips / memory TEG chip / package prototype using TEG chips / wire bonding technology / /

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