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Electronics manufacturing / Semiconductor device fabrication / Integrated circuits / Electrical engineering / Flip chip / Multi-chip module / Three-dimensional integrated circuit / Ball grid array / Chip scale package / Electronics / Electronic engineering / Electromagnetism
Date: 2006-09-15 16:02:52
Electronics manufacturing
Semiconductor device fabrication
Integrated circuits
Electrical engineering
Flip chip
Multi-chip module
Three-dimensional integrated circuit
Ball grid array
Chip scale package
Electronics
Electronic engineering
Electromagnetism

H. K. CHARLES  jr. Miniaturized Electronics Harry K. Charles Jr. S

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