| Document Date: 2006-09-15 16:02:52
Open Document File Size: 1,13 MBShare Result on Facebook
City Teflon / Nagakute / / Company WLPs / APL / Wide Bandgap Semiconductors / Development Laboratories / Toyota / Number 4 (2005) MINIATURIZED ELECTRONICS / Intel Corp. / / Country Japan / / Facility dam IC / MEMS arena / / IndustryTerm emiconductor device / power devices / count products / technology range / optoelectronics technology / electronic technology / mechanical devices / miniaturized electronics / planar chip/carrier surface / long minority carrier lifecation requirements / hardware products / flip-chip technology / wireless telephones / mainstay electronic devices / middle-ground technology / electronic systems / metal / microwave power devices / microphone amplifier systems / energy dissipation / circuit technology / electronic applications / normal transistor-based circuit technology / adaptable chips / electronic system applications / flip-chip / microwave applications / electronics industry / electronic devices / ambipolar device / semiconductor-based technologies / programming algorithms / manufacturing / rigid semiconducting chip / steel / certain new chips / stan10 dard silicon chip / larger devices / ceramic carrier / indiFlip-chip / nanoelectronic technology / microwave chips / metal traces / device technology / carrier substrate flush / chip-sized chromatography systems / ceramic technology / density chips / organic-based laminate technology / signal processing / connected hardware products / patterned metal / electronic products / conventional technology / chemical vapor disposition / carrier momentum reversal / miniaturized electronic systems / high-power communications / electronic device technology / power applications / screen printing / end-use system applications / direct-chip / fluid pumping systems / possible solution / oil drilling / electronics / formance devices / substrate technology / sized chips / spaceflight electronics / active devices / semiconductor chips / software control / / Person Harry K. Charles Jr. / / Position Major / / Product SiC / / Technology FPGA / interconnection Pin-in-hole Surface-mount technology / high-density chips / 19 flip-chip technology / 3-D / substrate technology / Adhesive-based flip-chip technology / MEMS technology / organic-based laminate technology / circuit technology / optoelectronics technology / integrated circuits / same chip / stan10 dard silicon chip / rigid semiconducting chip / IC chip / microelectromechanical systems / MEMS / semiconductors / technology of potential future interest / microwave chips / bonding pad Wirebond Wire bond SiO2/Si3N4 n+ IC chip Underfill IC SiO2 Chip passivation Chip / conventional flip-chip technology / semiconductor chips / optoelectronics / cell phones / electronic device technology / adaptable chips / semiconductor / using MCM-D technology / Barrier layer metallurgy Glass/ solder dam IC chip / stud-bumped chip / ELECTRONIC PACKAGING While chip / CIRCUITS Silicon-based IC technology / semiconductor-based technologies / thin chips / wireless devices / conventional technology / enclosed chip / microwave / lithography / similarly sized chips / MCM-C technology / described previously.26 Which technology / laser / CMOS technology / packaging technology / 1970 1975 1980 1985 1990 1995 2000 2005 2010 GaAs chips / GaN technology / IC technology / dielectric / middle-ground technology / digital cameras / normal transistor-based circuit technology / board design / two technologies / device technology / 3 Chip / /
SocialTag |
H. K. CHARLES jr. Miniaturized Electronics Harry K. Charles Jr. S