Ziptronix and Customer Pursue Lower-Cost 3D Memory With DBI® Wafer Bonding and Interconnect Technology Ability to Replace Die Stacking with High-strength Wafer Stacking Simplifies Process Flows, Increases Interconnect D - Wafer bonding - Document - PDFSEARCH.IO

First Page	Meta Content
	Ziptronix and Customer Pursue Lower-Cost 3D Memory With DBI® Wafer Bonding and Interconnect Technology Ability to Replace Die Stacking with High-strength Wafer Stacking Simplifies Process Flows, Increases Interconnect D Add to Reading List Document Date: 2012-12-12 11:53:15 Open Document File Size: 165,82 KB Share Result on Facebook City SAN DIEGO / / Company Ziptronix Inc. / / Continent Europe / / Country United States / / Facility D facility / / IndustryTerm 3D-integration technology / backside imaging / semiconductor applications / semiconductor supply chain / interconnect technologies / finished 3D devices / 3D memory applications / portable memory applications / low-temperature direct bond technology / direct bonding technology / bonding solution / circuit technology / 3D technology / interconnect processing / / Person Dan Donabedian / / Position CEO / / ProvinceOrState California / / Technology semiconductor / low-temperature direct bond technology / 3D technology / integrated circuit technology / integrated circuits / 3D-integration technology / direct bonding technology / / SocialTag Electronics Integrated circuit Wafer Through-silicon via Silicon Three-dimensional integrated circuit Wafer backgrinding Semiconductor device fabrication Chemistry Microtechnology

Ziptronix and Customer Pursue Lower-Cost 3D Memory With DBI® Wafer Bonding and Interconnect Technology Ability to Replace Die Stacking with High-strength Wafer Stacking Simplifies Process Flows, Increases Interconnect DAdd to Reading List