chip technologies / electrical/chemical characterization / carrier materials / electronic technologies / integrated systems / connection technologies / technology workshops / microsystem technology / manufacturing costs / standards communications / security technology / energy-efficient lighting / microelectronic products / technology development / intelligent machinery / ultra-thin chips / tronic products / wireless sensor systems / power electronics / metallography typing equipment / electronic products / technology branches / electronic systems / wafer level packaging solutions / carrier substrates / power-electronic systems / characterization technologies / integrated energy-sufficient sensors / reliability systems / durability electronics / energy requirements / time integrating microelectronic systems / art equipment / flip-chip / electronic devices / electronics / driver assistance systems / applicable management / chemical / thorough technology knowledge / high-tech development / circuit board processing line / requirements systems / online failure detection / wireless microsystems / technology transfer / /
Organization
Institute for Reliability and Microintegration / Test Center for Electronic Assemblies / Center for MicroMechatronics Services Design / Application Center / German federal ministry / /
Person
Andreas Middendorf / Jung Me / Nils F. Nissen / Martin Schneider-Ramelow / Stephan Guttowski / Wolf Telefon / Olaf Wittler / Frank Ansorge Telefon / Rolf Aschenbrenner / Rafael Jordan Lighting / Eckart Hoene Testing / / /
F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Electronic Packaging & System Integration Invisible –