Wafer-scale integration

Results: 7



#Item
1Materials science / Stepper / Photomask / Wafer / Chuck / Resist / Very-large-scale integration / Semiconductor device fabrication / Technology / Microtechnology

Chapter[removed]Canon 4X Projection Mask Aligner

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Source URL: nanolab.berkeley.edu

Language: English - Date: 2011-10-17 15:26:00
2Materials science / Flip chip / Wafer-level packaging / Chip scale package / Microelectromechanical systems / Solder / RTI International / Reliability / Wafer / Semiconductor device fabrication / Electronics / Technology

MICROSYSTEM INTEGRATION AND PACKAGING Advanced Interconnect and Packaging Technologies RTI International is home to one of the premier wafer bumping and wafer-level packaging research and fabrication facilities in the U

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Source URL: www.rti.org

Language: English - Date: 2014-10-29 13:23:56
3Semiconductor device fabrication / Electromagnetism / Wafer testing / MOSFET / Ring oscillator / Very-large-scale integration / Wafer / Process corners / Application-specific integrated circuit / Electronic engineering / Integrated circuits / Electronics

Design Dependent Process Monitoring for Back-end Manufacturing Cost Reduction Tuck-Boon Chan∗ , Aashish Pant∗ , Lerong Cheng† , Puneet Gupta∗ {tuckie,apant,puneet}@ee.ucla.edu, [removed], ∗ Depa

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Source URL: nanocad.ee.ucla.edu

Language: English - Date: 2010-09-27 14:41:05
4Digital electronics / Semiconductor device fabrication / Design for X / Electronic design automation / Wafer-scale integration / Integrated circuit / Redundancy / Reliability engineering / Yield / Electronic engineering / Engineering / Physics

Defect Tolerance in VLSI Circuits: Techniques and Yield Analysis ISRAEL KOREN, FELLOW, IEEE, and ZAHAVA KOREN Current very-large-scale-integration (VLSI) technology allows the manufacture of large-area integrated circuit

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Source URL: euler.ecs.umass.edu

Language: English - Date: 2013-07-03 13:02:54
5Semiconductor device fabrication / Electromagnetism / Electronic design automation / Three-dimensional integrated circuit / Back end of line / Through-silicon via / Application-specific integrated circuit / Very-large-scale integration / Wafer / Electronic engineering / Electronics / Integrated circuits

3A-1 System-Level Cost Analysis and Design Exploration for Three-Dimensional

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Source URL: www.cse.psu.edu

Language: English - Date: 2009-02-25 12:13:45
6Microtechnology / Three-dimensional integrated circuit / Back end of line / Wafer / Very-large-scale integration / Microelectromechanical systems / Monocrystalline silicon / Flip chip / Etching / Semiconductor device fabrication / Electronics / Technology

FUTURE VISIONS AND CURRENT CONCERNS SECTION 1

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Source URL: homepages.rpi.edu

Language: English - Date: 2012-03-29 22:25:26
7Integrated circuits / Architectural design / Semiconductor device fabrication / Electronic design automation / Lynn Conway / Mead & Conway revolution / VLSI Technology / Very-large-scale integration / Multi-project wafer service / Electronic engineering / Electronics / Technology

PDF Document

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Source URL: ai.eecs.umich.edu

Language: English - Date: 2009-01-10 14:57:52
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