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 Date: 2005-06-13 11:06:39Semiconductor device fabrication Nanotechnology Etching Microelectromechanical systems Transducers Surface micromachining Deep reactive-ion etching Comb drive Advanced Silicon Etch Microtechnology Materials science Technology |
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POST-CMOS PROCESSING FOR HIGH-ASPECT-RATIO INTEGRATED SILICON MICROSTRUCTURES Huikai Xie*, Lars Erdmann*, Xu Zhu*, Kaigham J. Gabriel*† and Gary K. Fedder*† * Department of Electrical and Computer Engineering and †