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Semiconductor device fabrication / Nanotechnology / Etching / Microelectromechanical systems / Transducers / Surface micromachining / Deep reactive-ion etching / Comb drive / Advanced Silicon Etch / Microtechnology / Materials science / Technology


POST-CMOS PROCESSING FOR HIGH-ASPECT-RATIO INTEGRATED SILICON MICROSTRUCTURES Huikai Xie*, Lars Erdmann*, Xu Zhu*, Kaigham J. Gabriel*† and Gary K. Fedder*† * Department of Electrical and Computer Engineering and †
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Document Date: 2005-06-13 11:06:39

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City

Orlando / San Francisco / Miyazaki / Sendai / San Diego / /

Company

Hewlett Packard / Robert Bosch GmbH / Ge / /

Country

Japan / United States / /

Facility

guarCMOS bridge / †The Robotics Institute Carnegie Mellon University / CMOS bridge / /

IndustryTerm

metal / clean device / metal layer / carrier wafer / inertial applications / postCMOS processing / metal layers / /

Organization

Department of Electrical and Computer Engineering / Carnegie Mellon University / Pittsburgh / /

Person

Chris Seung-Bok Lee / Island / Lars Erdmann / R.T. Howe / Sejin Han / P.T. Jones / Gary K. Fedder / /

Position

King / Head / /

ProgrammingLanguage

FL / /

ProvinceOrState

Pennsylvania / California / /

Technology

MEMS / square CMOS chips / dielectric / simulation / photolithography / integrated circuits / /

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