Maydan Technology Center Group / Thin Film Characterization Laboratory / Nanochip Technology Journal Applied Materials Inc. / Applied Materials Inc. / Mei / Astra / Varian / METAL CAPPING Applied Materials Inc. / 20Å CVD Co / CVD Co Applied Materials Inc. / 15Å CVD Co. / CVD Co METAL / Interconnect Nanochip Technology Journal Applied Materials Inc. / Dielectric Systems / No Cobalt 15Å CVD Co / Modules / Contact Resistivity Nanochip Technology Journal Applied Materials Inc. / CVD Co / /
Country
France / Canada / United States / /
Currency
Rs / / /
Event
Employment Change / /
Facility
University of Illinois / Paul Sabatier University / Babson College / University of Washington / Utah State University / University of Arizona / Simon Fraser University / North Carolina State University / California Institute of Technology / University of Michigan / University of California / National University of Singapore / Rensselaer Polytechnic Institute / Brandeis University / San Jose State University / /
IndustryTerm
logical solution / important manufacturing consideration / Device processing technology / memory devices / disruptive solutions / energy / memory technologies / metal / levels increases manufacturing complexity / mobile devices / manufacturing / test chip / logic devices / rapid thermal processing / imminent solution / gas source / technology innovations / chemical engineering / logic applications / wet clean vs. chemical plasma dry pre-clean / cyclic plasma-enhanced chemical vapor deposition / liner applications / deposition technology / transistor technology / rapid thermal processor / technology manufacturers / chemical / technology node / fabrication technologies / /
Organization
University of Washington / Rensselaer Polytechnic Institute / Utah State University / North Carolina State University / University of California / San Diego / Brandeis University / California Institute of Technology / National University of Singapore / MIT / University of Illinois / Chicago / University of California / Berkeley / Babson College / Chief Technologist office of the Silicon Systems Group / San Jose State University / University of Arizona / the University of Michigan / Simon Fraser University / /
member of technical staff / director of transistor technology / PVD Applied Producer / integration engineer in the transistor technology group / senior technology program manager / Major / senior process engineer / driver / program manager / technology manager / director of strategic marketing / process applications manager / Vice President / General Manager Metal Deposition Products Silicon Systems Group / director / candidate / technology manager in business unit / /
Product
Centura / /
ProgrammingLanguage
DC / RC / /
ProvinceOrState
British Columbia / Michigan / Utah / California / Arizona / Illinois / /
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Applied Physics Letters / /
Technology
memory technologies / Dry Cleaning Technology / fabrication technologies / deposition technology / chemical vapor deposition / mobile devices / CMP / Flash / Device processing technology / semiconductor / Adam / lithography / transistor technology / test chip / Laser / rapid thermal processor / rapid thermal processing / radio frequency / Dopant-Segregated Source/Drain Technology / /
NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT