![Electronics manufacturing / Wafer bonding / Semiconductor device fabrication / Wafer / Chemical bonding / Anodic bonding / Direct bonding / 100 micrometres / Microelectromechanical systems / Microtechnology / Electronics / Technology Electronics manufacturing / Wafer bonding / Semiconductor device fabrication / Wafer / Chemical bonding / Anodic bonding / Direct bonding / 100 micrometres / Microelectromechanical systems / Microtechnology / Electronics / Technology](https://www.pdfsearch.io/img/530176014560aaa960468ec810b3df0c.jpg)
| Document Date: 2015-01-15 06:53:22 Open Document File Size: 164,09 KBShare Result on Facebook
Country Germany / / / Facility Fraunhofer Institute / / IndustryTerm wet chemical etching / / Organization SEMI / Fraunhofer Institute for Electronic Silicon / / Person SEMI-FINISHED BONDED SUBSTRATES / / / Technology Dielectric / /
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