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Technology / Wafer bonding / Thermocompression bonding / Anodic bonding / Direct bonding / Chemical bond / Reactive bonding / Eutectic bonding / Microtechnology / Electronics / Electronics manufacturing


THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS Contact
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Document Date: 2015-01-15 06:04:42

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File Size: 368,60 KB

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Facility

Fraunhofer Institute / /

IndustryTerm

electronics aspects / metal thermocompression bonding / /

Organization

African Union / /

Person

Maik Wiemer / Joerg Froemel / /

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