THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS Contact

First Page		Document Content
Date: 2015-01-15 06:04:42 Technology Wafer bonding Thermocompression bonding Anodic bonding Direct bonding Chemical bond Reactive bonding Eutectic bonding Microtechnology Electronics Electronics manufacturing		THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS Contact Add to Reading List Source URL: www.enas.fraunhofer.de Download Document from Source Website File Size: 368,60 KB Share Document on Facebook

	Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication DocID: 1oWR7 - View Document
	SEMI-FINISHED BONDED SUBSTRATES: SOI-WAFER (SILICON ON INSULATOR) 1 DocID: L8KZ - View Document
	THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS Contact DocID: L4XG - View Document
	SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µm DocID: KSly - View Document